elmariachi
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- May 30, 2005
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AMD less efficient at heat dissipation because the CCDs are offset to one side, HW canucks tested this comparing coolers with and w/o offset mount.
Zen 5 actually has intrinsically better thermals because they changed the die floor plan specifically for this (TPU asked AMD about this). Stock Granite Ridge parts tend to have more thermal headroom than Raphael did; even with similar power limits. I assume they'll also be binning the CCDs for lower leakage before they grind it down and slap the v-cache and support silicon on it for the X3D 9000 series.
I was thinking how else they could improve temps, but I don't think there is much they can do beyond what's already been done to the floor plan and binning. Fewer thermal interfaces would be nice and it should be technically possible to have the v-cache die just cover the whole CCX with empty silicon above the cores, but that would be a huge waste of wafer area. It would also be possible to only carve out the section of the CCD where the v-cache die would sit, omitting the need for separate support silicon entirely, but I don't think production costs would be economical either.
