What is the best thermal compound application method?

[ondooy]

 

[Danden]

injection most easy

 

[royfrosty]

Cpu i would say thermal paste any methods are fine as not too little or too much will do.

As for gpu. Only hbm based need to add a little more.

 

[bunnypangsai]

Cpu i would say thermal paste any methods are fine as not too little or too much will do.

As for gpu. Only hbm based need to add a little more.

toothpaste can bo?

 

[royfrosty]

toothpaste can bo?

You try liao let me know. Thanks

 

[enenyi]

I remember someone in HWC told me not to spread kaya when applying thermal paste.

 

[koreanlover]

I remember someone in HWC told me not to spread kaya when applying thermal paste.

Yes might cause air bubbles when CPU is installed.

 

[Ohayo!]

thin layer best

 

[NobunagaOda]

injection most easy

Why is this so?

 

[ykgoh]

Dot, cross or circle?

 

[ragnarok95]

I remember someone in HWC told me not to spread kaya when applying thermal paste.

I still spread evenly, IF i am not lazy.

Nowadays i am so lazy i just use the bird sai method.

 

[Mycrus]

As long as its applied... i paint it on with a credit card

 

[wacko]

good to know i'm not the only one with OCD, who doesn't want to have the possibility of the TIM not covering the corners of the IHS...

 

[enenyi]

I still spread evenly, IF i am not lazy.

Nowadays i am so lazy i just use the bird sai method.

Do u have the sides thicker than the centre after installing the CPU cooler?

Coz that's wad I realised. The pressure from CPU cooler forces some thermal paste to the sides of the CPU. It would be amazing if the thermal paste doesnt get squished out from the sides like some peanut butter sandwich...

 

[ragnarok95]

Do u have the sides thicker than the centre after installing the CPU cooler?

Coz that's wad I realised. The pressure from CPU cooler forces some thermal paste to the sides of the CPU. It would be amazing if the thermal paste doesnt get squished out from the sides like some peanut butter sandwich...

Pressure mah. U spread edge to edge under pressure sure will squish out one.

 

[yknyong1]

One dot can already. Self spread under pressure. Unless pressure not enough which is a different story.

 

[ragnarok95]

No right method la. Just go whichever you like.

 

[enenyi]

Pressure mah. U spread edge to edge under pressure sure will squish out one.

Yeah haha.

Though that LTT video a bit weird. Put too much and causing it to seep to the sides shld be higher temps coz not enough thermal paste at the centre to conduct heat away from the centre of the chip. Maybe Luke was testing the chip at stock speeds...