A
Since you're gonna do this over anyway:
I came across a YouTube video the other day that says to use the 1mm thermal pad just for the controller, and to use a separate 0.5mm pad just for the nand chips.
This makes up for the difference in height between the two (controller was 0.5mm shorter), and should result in a better fit and a more even contact surface with the TBU405 case.
I did it 2 days ago, and have already noticed a marked improvement in temperature.
Hope this helps.
Mine did not come with heat sink.
my thermal pad only applied to the controller, meaning I cut it into half only. that could be the reason, I will try again. Thank you.
Since you're gonna do this over anyway:
I came across a YouTube video the other day that says to use the 1mm thermal pad just for the controller, and to use a separate 0.5mm pad just for the nand chips.
This makes up for the difference in height between the two (controller was 0.5mm shorter), and should result in a better fit and a more even contact surface with the TBU405 case.
I did it 2 days ago, and have already noticed a marked improvement in temperature.
Hope this helps.